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Brochures
Technical Datasheets
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Quik-Pak Provides The
Widest Selection
of Open Cavity Plastic Package Options for
Prototyping
Packaging is no longer an after-thought in the design process. Package selection must be integrated into the design program. Quik-Pak can transform any transfer molded plastic device into a ready-to-assemble open cavity plastic package.
The proliferation of package types has been explosive. In 1980 there were about 30 different package types, all DIPs, according to Gartner Dataquest. That grew to 250 different package types in 1995 and ballooned to 800 when ball grid array (BGA) packaging took hold in 2000. By 2005, Gartner Dataquest predicts there will be 1,500 different types of packages, driven by the move to chip scale packages (CSPs). - read more
Quick-Turn Assembly Services
Within hours of your wafer availability
Plastic or ceramic packages, gold or aluminum wire. Our assembly services handle all packages, including the popular SOT, MLF & QFN. - read more
Consider the Advantages
You'll see that Quik-Pak offers you a distinct competitive advantage when time is of the essence in getting your new product to market.
- New designs can be characterized in a few days, with devices left over for customer samples
- Assemble prototypes in the plastic i.c. package of your choice
- No more prototyping in ceramic while production device is in plastic
- Eliminates the need for custom molded packages
- Lower cost than prototyping in ceramic packages
- Realistic performance comparison with production plastic package
- Ideal for RF device tuning, FIB or surface probing within the package
- On-shore assembly - within hours of your wafer availability
For More Information
Contact us to get more information. We look forward to hearing from you.
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Ph: 858 674-4676
