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Quik-Pak Acquires Flip Chip
Assembly, Radiation Sensor
and Laser Micromachining Business
Units of Aguila Technologies
San Diego, CA, September 25, 2008 - Quik-Pak, a division of Delphon Industries, announced today the acquisition of Aguila Technologies' flip chip assembly, detector array processing, and laser micromachining business units. The acquisition is part of Quik-Pak's ongoing effort to expand its advanced packaging and assembly services. Click here to read more
Quik-Pak IC Design, Packaging and Prototyping Firms Partner To Service Customers in Europe
San Diego, CA, May 5, 2008 - Quik-Pak, a division of Delphon Industries, announced today that it will partner with UK based Optocap limited to provide European customers with a full turnkey solution for their IC packaging and prototyping needs. The two companies will co-exhibit at the upcoming IET & GSA International Semiconductor Forum in London, England May 14-15. Click here to read more
Quik-Pak Attains ISO
9001:2000 Certifcation
Quik-Pak, a division of Delphon Industries, announced today that it
has met the strict requirements for ISO compliance and has been awarded ISO 9001:2000 certification for its IC packaging, assembly and prototyping services. Click here to read more
Quik-Pak Announces
Wafer Backgrinding Services
San Diego, August 21, 2007 - Quik-Pak, a division of Delphon
Industries and leader in quick-turn integrated circuit (IC) packaging, assembly and service, has announced the installation of a new Disco Automatic Surface Grinding system. This equipment provides in-house capability to grind wafers up to 200mm in diameter down to a thickness of 150µm (6 mils), supporting the latest package technology and stacked die applications. This newest capital acquisition, along with a Royce Pick & Place system, scheduled for September installation, complements the existing Disco Automatic Wafer Dicing Saw and allows Quik-Pak to deliver complete wafer preparation services. Quik-Pak is also the world's largest supplier of open cavity plastic packages, that give IC designers the option to insert new die in existing production packages for design verification, testing and customer samples. Click here to read more
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Ph: 858 674-4676
