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To view an online presentation of the Quik-Pak process, click here
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THE QUIK-PAK
COMPETITIVE
ADVANTAGE
Quik-Pak understands that new IC designs drive industry growth and that time to market is critical to design engineering organizations. Quik-Pak's unique patented Open-Cavity Plastic Package Technology (OCPP), combined with its modern IC assembly and wafer sawing services provide leading semiconductor IDM and Fabless companies worldwide with a strategic advantage for their I.C. design programs. Quik-Pak's employees know the value of each order, take pride in product quality and always have full customer satisfaction in mind. When your order is placed, you can be assured that Quik-Pak will meet your delivery schedule with unmatched quality and service.
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Quik-Pak Services:
- Unlimited Open Cavity Plastic Packages (OCPP)
- Including latest dual row MLF, DFN and BGA's
- Remolded to JEDEC Standards
- IC Assembly Services
- Plastic Assembly
- Chip on Board Assembly
- MEMS Assembly
- Stacked Die and Multi Die Assembly
- Ceramic Assembly
- Wafer Sawing, Backgrinding
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Decreased Time to Market
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Assembled prototypes in ANY PLASTIC PACKAGE in 24hrs or less. |
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No offshore assembly delays. |
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Duplicates production package performance. |
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Branded engineering samples drop shipped to your customer within 24 hours. |
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Complete turn-key solution.
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Reduced Prototype Costs
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Eliminates conventional ceramic-based prototyping and special socket requirements. |
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Saves engineering time. |
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Single setup charge covers multiple design revisions. |
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NO MINIMUM ORDERS, only pay for units ordered and delivered |
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Design Verification
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Prototype in your required IC plastic package - no limitations. |
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Utilizes production style packages, not "plastic equivalents". |
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Accurate performance evaluation. |
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Accurate validation of simulations. |
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Actual electrical parameters. |
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Open-Cavity format ideal for performance debug (circuit probing, FIB adjustments.) |
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Test socket compatible. |
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Multiple encapsulation options. |
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Ph: 858 674-4676
